It is already known that Apple is designing a custom server chip with Broadcom, with manufacturing expected to be handled by TSMC. A fresh note now suggests Job’s Mob may lean on Troubled Chipzilla for back-end packaging.

For those who came in late, TSMC’s CoWoS supply is severely constrained, even as demand for advanced AI silicon continues to climb.

CoWoS, or Chip-on-Wafer-on-Substrate, allows CPUs, GPUs, and high-bandwidth memory to be tightly integrated onto a silicon interposer. It has become essential for modern AI accelerators, and everyone wants a slice of it.

In a note to investors, brokers GF Securities Hong Kong said Intel is likely to “benefit from the CoWoS undersupply of TSMC,” pointing to opportunities outside pure wafer fabrication.

The note repeats earlier claims that Apple is evaluating Intel’s 18A-P process for its lowest-end M-series chips, which are expected to ship in 2027. Job’s Mob has reportedly signed an NDA with Intel and already obtained PDK samples for assessment.

The brokerage said bespoke ASICs designed by Apple and Broadcom are expected to use Intel’s EMIB packaging technology in 2028.

Reports in spring 2024 said Apple and Broadcom were developing an AI server chip internally known as Baltra, with shipments pencilled in for 2027. GF Securities now reckons that timeline may slip to 2028.

The same firm has suggested Apple could adopt Intel’s 18A-P process for non-Pro iPhone chips shipping in 2028. That node is Intel’s first to support Foveros Direct 3D hybrid bonding, enabling dense chiplet stacking via TSVs.

All this comes as Chipzilla readies a dedicated ASIC unit to help customers tape out custom silicon for specific workloads. For Intel, Apple snuffling around its packaging tech is unlikely to go unnoticed.