Taiwan giant turns to local partners as packaging crunch bites

TSMC is stuffed to the rafters with CoWoS orders, and the AI industry is sweating over it, although the company seems to have a cunning plan.

Taiwanese foundry forced to plan packaging a year in advance

TSMC is finding itself on the back foot as demand for its advanced packaging tech has exploded thanks to the AI chip gold rush, with firms like Nvidia breathing down its neck.

A patent surge, Nvidia’s shove, and a 2026 CPO rollout crank up the pressure.

TSMC has charged into silicon photonics and is trampling Troubled Chipzilla’s toes. Japanese reports say TSMC has filed nearly twice as many US patents in the latest silicon photonics field as Intel.

Taiwanese outfit bets big on CoWoS, SoIC, and CoW fab in Arizona

TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan.