Intel plays the packaging card to keep customers 

Troubled Chipzilla has decided the path to foundry salvation runs straight through the packaging plant. It’s now shouting from the rooftops that its real ace in the silicon arms race isn’t process nodes but how it wraps the goods.

All ready for 2016

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.