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PC Hardware
Friday, 11 December 2015 12:16
TSMC gets fan-out (InFO) wafer-level packaging
All ready for 2016
TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.
Thursday, 08 September 2011 11:42
Invensas unveils multi-die face-down packaging technology
And it is not going to take that lying down