
SK Hynix beats Samsung and TSMC to High-NA EUV
Korean outfit first to slot ASML’s kit into its fabs
SK Hynix has stolen a march on both Samsung and TSMC by becoming the first chipmaker to integrate ASML’s new High-NA EUV machinery into its fabs.

US pulls plug on TSMC's China waiver
We tell other countries what to do
The United States has yanked TSMC's authorisation to freely ship essential kit to its mainland plants, a move that could wreck the foundry’s China operations.

US pulls plug on Samsung and SK Hynix’s China kit
Waiver yanked, fabs stalled, shares tanked
Washington has slammed the door shut on a loophole that let South Korea’s biggest chipmakers sneak US gear into their Chinese fabs without the usual bureaucratic hoops.

SK hynix cranks out 321-layer QLC NAND
Chipmaker claims world’s first 300-plus layer QLC flash
SK hynix has started mass production of what it calls the world’s first 321-layer QLC NAND flash chip, a 2Tb storage device designed to push density well past anything seen before.

SK hynix preps 24 Gb GDDR7 for beefier GPUs
Kicks off HBM4 supply
SK hynix is cranking up the memory arms race, confirming it’s building 24 Gb GDDR7 modules to give next-gen GPUs fatter VRAM buffers while lining up HBM4 for AI and HPC workloads.

ASML outlook dims as Intel wobble spooks investors
Bank of America slashes forecast, doubts Intel and SK hynix will save high NA EUV tech
Bank of America has taken a scalpel to ASML’s share price target, hacking it down to €759 from €795 on the back of waning enthusiasm for its latest high numerical aperture (high NA) extreme ultraviolet (EUV) lithography gear.

SK hynix gets Nvidia’s HBM4 gig
Beats Samsung and Micron
SK hynix has pulled ahead of its memory rivals by bagging NVIDIA’s first HBM4 orders, giving the South Korean chipmaker a premium position for the launch of Nvidia's Rubin GPUs.

Micron beats SK hynix to HBM4 sampling
Micron claims pole position in high-bandwidth memory race
US memory outfit, Micron claims to have leapfrogged SK hynix in the HBM race by slipping samples of its 12-layer 36GB HBM4 to key clients.

SK hynix stacks 321-layer NAND for AI boost
Thinner, faster UFS 4.1 lands in 2026
SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, slightly more efficient, and apparently clever enough to know what you’re doing before you do.

SK Hynix doubles profit on AI chip boom
Brushes off tariff fears
SK Hynix, Nvidia’s go-to for high-bandwidth memory, has posted a 158 per cent leap in quarterly operating profit, hitting 7.4 trillion won (€5.1 billion), while shrugging off the usual US trade panic.