New chip could rattle Qualcomm, Chipzilla and AMD at Computex

Nvidia and MediaTek are teaming up to launch an Arm-based chip for AI-ready Windows PCs. The official reveal is set for Computex 2025.

Looks slick, plays slow, and still can't beat its own last-gen gear

Troubled Chipzilla has taken its trousers down to show off the innards of Arrow Lake, and while the chiplet-based design is a visual treat, it’s struggling to keep up where it matters in games.

AMD beats Apple and Intel to tape-out

TSMC's 2nm process node is cruising through development and is already showing better defect rates than 3nm and 7nm did at the same stage. 

Trying to copy AMD

Chipzilla might have found a way to copy AMD’s X3D cache magic, using its shiny new 18A-PT process and hybrid bonding trickery.

Intel plays the packaging card to keep customers 

Troubled Chipzilla has decided the path to foundry salvation runs straight through the packaging plant. It’s now shouting from the rooftops that its real ace in the silicon arms race isn’t process nodes but how it wraps the goods.

New ARC GPU push

Troubled Chipzilla has apparently slipped another ARC Battlemage graphics card into the pipeline, as a new “G31” model turned up in a shipping manifest en route to Intel Vietnam.

Chipzilla’s CEO Lip-Bu Tan leans into realism

Troubled Chipzilla is stretching its long-promised 18A process into two new variants aimed at feeding the AI beast and mainstream punters.

Bets on old-school lithography to dodge soaring costs

TSMC, once the trendy pioneer of bleeding-edge chipmaking, is now pulling a handbrake turn on high-NA EUV adoption.

Intel’s Cougar Cove and Darkmont blueprints

An perfmon update has outed Troubled Chipzilla’s upcoming Panther Lake CPUs, revealing core architecture codenames and CPUIDs

Japan and Europe first

MSI's PRO Z890-S WiFi Project Zero motherboard with back-connect design is finally coming to retail as MSI Japan has announced that it will go on sale on May 2nd, and the motherboard is already available in Europe at €264.