
Intel's 18A process creeps forward
Rumoured to be 55 per cent
Analysts at KeyBanc reckon Intel’s 18A yields have inched up to 55 per cent which is a modest five per cent improvement quarter-on-quarter.

Seagate ships massive 30TB hard drives to the masses
Heat-assisted tech delivers monster storage for $600
After more than two decades of hype and endless delays, Seagate has brought its heat-assisted magnetic recording drives to the great unwashed. Now, the riff-raff can buy a 30TB Seagate IronWolf Pro or Exos M hard drive if they have a spare $600. A a slightly smaller 28TB version is going for $570.

Nvidia ramps up SOCAMM modular memory production
Headed for AI PCs and servers
Nvidia is preparing up to 800,000 LPDDR-based SOCAMM modules this year ahead of a next-gen SOCAMM 2 launch designed to give its AI products superior performance and higher efficiency while remaining easily upgradeable.

Qualcomm might roll out proper smartwatch chip
Snapdragon Wear W6 ditches recycled silicon for something bespoke
The dark satanic rumour mill has manufactured a hell on earth yarn claiming that Qualcomm is finally going to take the wearable market seriously.

Intel's 18A node edges ahead of Samsung chip yields
There is a fight on for second place
Troubled Chipzilla appears to be clawing its way back into the semiconductor race, at least according to a research note from KeyBanc Capital Markets.

Samsung braces for worst quarter
US chip curbs and HBM3E delays dent profit forecast
Samsung Electronics stunned markets by forecasting a 56 per cent plunge in second‑quarter operating profit to Won 4.6 trn (€3.3 bn, which is its weakest performance in six quarters.

TSMC throws cash at US plants while Japan is left waiting
Chipmaker races Trump tariffs as Samsung’s fab stands idle
While Samsung’s much-hyped Texas fab is still sitting around looking pretty, struggling to find buyers, TSMC is bulldozing ahead with its American chip-building binge.

Samsung to show off three panelled phone
Multi-fold madness teased through One UI 8 leak
Samsung is getting ready to pull back the curtain on its next generation of bendy gadgets at its Unpacked event next week, with the Galaxy Z Fold 7, Galaxy Z Flip 7 and possibly the Galaxy Z Flip FE expected to make an appearance. But the real curiosity could be something even flappier: a tri-fold foldable going by the codename Multifold 7, possibly landing as the Galaxy G Fold.

Samsung can't find customers for shiny new US fab
White elephant
Samsung is dragging its feet over the launch of its chip fab in Taylor, Texas, thanks to an awkward lack of customers willing to buy what it plans to churn out.

Xiaomi’s Pad 7s PRO 12.5 targets iPad Pro and Samsung Tabs
Custom silicon, fast charging and Dolby Atmos in the mix
Xiaomi has stepped up its hardware game again, this time with the launch of the Pad 7S Pro 12.5, the first tablet powered by its in-house Xring O1 chipset.