The startling figure emerged from a presentation by Taiwan Microloops Corp at the OCP APAC Summit, where the firm showed off its beefed-up liquid cooling solutions. The SP7 platform will replace SP5, which currently supports Genoa and Turin, and will play host to Venice and Verano CPUs with Venice topping out at 256 cores.

AMD's current top-end EPYC Turin parts go up to around 500W, and even that can rise in certain configurations. Bumping that to 700W, let alone 1400W, is a staggering leap.

Microloops is shipping liquid cold plates rated for kilowatt-class cooling. These include new metal-stiffened units with acrylic covers and dual ports, designed to shift serious heat away from the silicon. The system’s mounting layout echoes that of the SP5, but the cooling demands are anything but familiar.

Despite the eye-watering wattages, AMD insists performance-per-watt will continue to improve. Zen 6 may sip energy in relative terms, even if the chips themselves guzzle it by the litre.

Meanwhile, Fabric8Labs is offering an alternative to traditional cold plates with its ECAM (electrochemical additive manufacturing) technology. Unveiled at Hot Chips 2025, the tech allows for bespoke 3D cooling channels directly printed in copper, improving thermal resistance and shaving operating costs.

Fabric8 claims these next-gen heat sinks can outperform straight microchannels by up to 85 per cent. Their roadmap includes plans to scale ECAM from board-level cooling to direct-to-silicon integration by 2028.

Zen 6-based EPYC Venice CPUs are expected to land next year, going head-to-head with Chipzilla’s Clearwater Forest Xeon E-Core and Diamond Rapids Xeon P-Core ranges. If AMD is serious about 1400W chips, the arms race in server cooling may have only just begun.