Official invites sent out

Samsung has officially sent out invites for its next Unpacked event scheduled for February 25th, just a day before the Mobile World Congress 2018 in Barcelona, where the company is expected to unveil its newest flagship, the Galaxy S9.

Temporarily

After the 860 Pro SSD was spotted on Samsung's site, yet another new SSD line has leaked from the same source, the Samsung 860 EVO.

Based on 10nm-class manufacturing process

Samsung has announced that it has started mass production of 16Gb GDDR6 memory chips, offering twice the speed and density levels compared to currently available GDDR5 memory chips.

14nm SoC with hexa-core Cortex-A73 and Cortex-A53 CPU cores

Samsung announced its newest SoC built on 14nm FinFET manufacturing process and aimed at mid-range devices, the Exynos 7872 SoC.

With US $1,899 price tag

Samsung has released some of the first information regarding its upcoming 860 Pro SSD lineup, in the form of a 4TB model listed on its own website.

Codename Aquabolt

Samsung said  it has started mass production of its 2nd generation 8GB HBM2 chips, codename Aquabolt.

Was expected at CES

Samsung will unveil its next flagship handset, the Galaxy S9, next month at Mobile World Congress (MWC) and not CES as expected

Might even launch in March

Samsung has pulled a rather surprising move, officially confirming that the next Galaxy flagship will be unveiled at the MWC 2018 show in February.

Viva, Las Vegas

A power cut, of all things, downed the Computer Electronics Show (CES) in Las Vegas today.

Able to leap over bottlenecks in a single bound

Super Micro has been showing the assorted throngs at CES its all-flash NVMe™ (Non-Volatile Memory Express) 1U SuperServer which can accommodate up to 36 hot-swap Samsung NGSFF NVMe SSDs.