AI chip boom leaves TSMC scrambling to meet demand
Taiwanese foundry forced to plan packaging a year in advance
TSMC is finding itself on the back foot as demand for its advanced packaging tech has exploded thanks to the AI chip gold rush, with firms like Nvidia breathing down its neck.
TSMC muscles into silicon photonics, leaving Intel gasping
A patent surge, Nvidia’s shove, and a 2026 CPO rollout crank up the pressure.
TSMC has charged into silicon photonics and is trampling Troubled Chipzilla’s toes. Japanese reports say TSMC has filed nearly twice as many US patents in the latest silicon photonics field as Intel.
TSMC to bring chip packaging tech to US
Taiwanese outfit bets big on CoWoS, SoIC, and CoW fab in Arizona
TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan.