TSMC to bring chip packaging tech to US
Published in PC Hardware
Tuesday, 29 July 2025 10:05

TSMC to bring chip packaging tech to US


Taiwanese outfit bets big on CoWoS, SoIC, and CoW fab in Arizona

TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan.

India will not save Apple's iPhone cash cow
Published in Mobiles


It is just too expensive

Apple’s hopes that it might prolong the life of its sacred cash cow the iPhone in India are proving false.