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MediaTek pushes Dimensity 9500 into flagship fight

by on23 September 2025


Wants nearly 40 per cent of global mobile share

MediaTek has unveiled its Dimensity 9500, a 5G flagship chip built on TSMC’s N3P process and pitched as “super powerful and super cool.”

General manager Chen Guanzhou said the Dimensity brand has pushed the company’s mobile silicon to nearly 40 per cent of the global handset market. He admitted the flagship part of the market is below that figure, but if MediaTek can drag it up to the same level, then it will get the 40 per cent figure it wants.

The first handset to ship with the new silicon will be vivo’s X300, expected in the fourth quarter. The Dimensity 9500 has a full-core CPU with a C1-Ultra core clocked at 4.21 GHz, three C1-Premium cores, and four C1-Pro cores. It is the first SoC in the industry to support four-channel UFS 4.1 flash memory.

Compared with its predecessor, MediaTek claims single-core performance is up 32 per cent, multi-core performance 17 per cent higher, and peak power consumption down by 37 per cent. The giant core, running at the same level, allegedly sips 55 per cent less juice than before.

A new Mali G1-Ultra GPU brings higher peak throughput, more efficient power use, and far better ray tracing. MediaTek insists it will give mobile games “console-level” graphics and buttery frame rates, though whether your phone battery agrees is another matter.

Senior vice president Xu Jingquan said MediaTek’s footprint in the flagship market is growing steadily, helped by Chinese brand adoption but also by inroads in international markets and tablet products.

Looking at the wider phone business, Xu reckoned growth this year will be anaemic at just one to two per cent. Subsidies in China front-loaded demand in the first half, he said, but did not fundamentally shift the trend. He expects the same sluggish one to two per cent rise in 2026.

Last modified on 23 September 2025
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