AI chip boom leaves TSMC scrambling to meet demand
Published in News


Taiwanese foundry forced to plan packaging a year in advance

TSMC is finding itself on the back foot as demand for its advanced packaging tech has exploded thanks to the AI chip gold rush, with firms like Nvidia breathing down its neck.

Apple’s wafer-thin iPhone Air leaves fanboys cold
Published in Mobiles


Fruity Cargo Cult tries to wow punters with pointless thinness

The new iPhone Air is so thin it might snap in a stiff breeze and even the die-hard Apple fanboys aren't cheering.

Oracle shouts about AI contracts
Published in News


AI is cool for Catz

Oracle has stopped sulking about being late to cloud and is banging on about how it has become a must-have for the AI set.

AMD says FSR Redstone still coming in 2025
Published in News


Promises path tracing to rival DLSS 4

AMD has confirmed that its long-teased FSR Redstone tech is still on track for a 2025 release, with a full presentation expected later this year.

Apple iPhone 16 Pro can be fried by car LiDAR
Published in Mobiles


Volvo’s lasers scarred my camera

YouTube tech celeb Marques Brownlee, better known as MKBHD, has discovered that his expensive iPhone 16 Pro camera can be permanently cooked by the lasers from self-driving cars.