Beancounters at Counterpoint Research have added up some numbers and divided by their shoe size and reached the conclusion that the Foundry 2.0 sector was worth $72.3 billion in the first quarter of 2025. TSMC's slice of that stayed flat quarter-on-quarter but marked a modest 0.9 percentage point jump compared to last year. Still, that's enough to keep it well ahead of the rest.

Troubled Chipzilla is now officially the second biggest player in this newly defined space. Intel gained 0.6 points in market share over the last quarter, though it’s still 0.3 down compared to the same period in 2024. Credit where it's due, Chipzilla’s 18A node and Foveros 3D packaging tech seem to be impressing someone.

Samsung is still flailing about trying to get its yield rates up. Despite pushing leading-edge nodes like 3nm, the Korean giant hasn’t managed to scale production to match TSMC’s wafer-churning machine. High defect rates remain a millstone around Samsung’s neck.

TSMC is  preparing for mass production of its 2nm process later this year and already ships thousands of wafers monthly without breaking a sweat. It also claims to be the largest photomask maker globally, which matters a lot since photomasks are central to how chip designs get transferred to silicon.

And with AI chip demand going through the roof, advanced packaging has become just as crucial. TSMC is doing most of its packaging but can’t keep up with demand, leaving space for others like ASE and UMC to mop up the overflow. Even so, TSMC’s stranglehold on the packaging side keeps it firmly at the top of the Foundry 2.0 food chain.